POWER ELECTRONICS PART 12 ONLINE MCQ EE AND ECE

POWER ELECTRONICS PART 12

POWER ELECTRONICS PART 12

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Attempt Free POWER ELECTRONICS PART 12 Here. Read The Important Electrical MCQ From Below.

[1]which of the following statements are true about VI characteristic of SCR?
A. Holding current is more than Latching current
B. SCR will trigger if the applied voltage exceeds forward break over voltage
C. SCR can be triggered without gate current
D. When the SCR is in reverse biased, small leakage current will flow
Options:
a. A, B and C
b. All are true
c. B, C, D
d. C, D

Answer

[2] which of the following statements are true about BJT?
(i) It has more power handling capability than MOSFET
(ii) Has higher switching speed than IGBT and MOSFET
(iii) Has low on state conduction resistance
(iv) Has second breakdown voltage problem
Options:
a. All are true
b. (i), (ii), (iii) and (iv)
c. (i), (iii) and (iv)
d. (ii), (iii) and (iv)

Answer

POWER ELECTRONICS PART 12

[3] For a JFET, when VDS is increased beyond the pinch off voltage, the drain current
a. Increases
b. Decreases
c. Remains constant
d. First decreases and then increases

Answer

[4] n-channel FETs are superior to P-channel FETs, because
a. They have higher input impedance
b. They have high switching time
c. They consume less power
d.  Mobility of electrons is greater than that of holes

Answer

[5] Which of the following is true about the diodes
a. During forward biased small amount of voltage drop will appear across anode and cathode
b. If the reverse voltage exceed VRRM the diode will destroy
c. trr is depends on softness factor
d. schottky diodes have low trr
Options:
(i) All are true
(ii) A, B, D
(iii) A, B,C
(iv) B,C, D

Answer
The feature of schottky diode is low forward voltage drop, not low trr.

[6] The MOSFET has
(i) Higher Power handling capability than BJT
(ii) Faster switching speed than BJT
(iii) High on state resistance
(iv) Secondary breakdown voltage problem
which of the above statements are incorrect?
Options:
a. (i), (iii), (iv)
b. (ii), (iii)
c. All of the above
d. (ii), (iii), (iv)

Answer

POWER ELECTRONICS PART 12

[7] Which of the following is called as uncontrolled
semiconductor device?
a.  Diode
b. Thyristor
c.  GTO
d.  MOSFET

Answer

[8] Which of the following is a half controlled semiconductor
device?
a. MOSFET
b. GTO

c. MCT
d. SCR

Answer

In SCR only turn on of the device an be controllable by the gate signal.
POWER ELECTRONICS PART 12

[9]Which of the following abbreviation is not a power semiconductor device?

a. SIT
b. SITH
c. MCT
d. IGCT
 Options:
1. a and d
2. a only
3. a, b, d
4. All are power semiconductor device
SIT – Static Induction Transistor
SITH – Static Induction Thyristor
MCT –  MOS Controlled
Thyristor
IGCT – Integrated Gate Commutated Thyristor
POWER ELECTRONICS PART 12
[10] Which of the following statements are correct?
a. IGBT is current driven device
b. IGCT is voltage driven device
c. MOSFET is voltage driven device
d. GTO is minority carrier device
Options:
1. a, b, c
2. b, c, d
3. All are correct
4. None are correct

Answer